The sustained surge in demand for AI computing power is driving the advanced packaging sector into a golden cycle marked by simultaneous growth in volume and price.

Sigmaintell's "Advanced Packaging Market Research Brief (2026)"provides core industry assessments, centering on four key dimensions: the supply-demand cycle, competitive landscape, market scale, and technological pathways.

Core Conclusions:

Global advanced packaging (2.5D/3D) capacity remains persistently tight, with the supply-demand imbalance expected to persist until the second half of 2027, after which a gradual move towards balance is anticipated.
The global advanced packaging capacity is projected to grow at a compound annual growth rate (CAGR) of 34% from 2025 to 2030, with a particularly high expansion rate of 47% during the rapid capacity build-out phase from 2025 to 2027.
The global advanced packaging market size is forecast to reach $61.8 billion in 2026, representing a year-on-year increase of approximately 76%. The upward price trend is expected to continue at least until the end of 2026.

Key Insights：

Distinct Supply-Demand Cycle:
Driven by the surge in demand for AI and HPC, lead times for advanced packaging are generally exceeding one year. The industry continues to work through a substantial order backlog, making capacity expansion the primary focus for manufacturers.

Clear Competitive Landscape:
TSMC commands 58% of the global advanced packaging capacity share, maintaining a "one superpower, multiple strong players" structure. ASE and Amkor are accelerating their expansion efforts. Mainland Chinese companies are rapidly catching up, leveraging opportunities in HBM packaging and domestic substitution.

Diversifying Technology Paths:
2.5D/3D packaging remains the mainstream currently. FOPLP is emerging as a key next-generation direction due to its cost and efficiency advantages, with both panel makers and OSATs making concurrent strategic moves.

Opportunities for Mainland Chinese Firms:
Advanced packaging faces relatively fewer geopolitical constraints. HBM packaging has become a significant growth driver for Chinese OSATs. Companies like JCET, Tongfu, and Huatian are steadily enhancing their global competitiveness.

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